ICMEEA

Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

2026 3rd International Conference on Mechanics, Electronics Engineering and Automation (ICMEEA 2026), was held in Singapore (hybrid) during April 24-26, 2026, providing a forum for researchers and experts involved in different but related domains to confront research results. The scope of ICMEEA 2026 includes the research and development of collaboration technologies to mechanical engineering, electronic engineering, control system and automation of systems.

Editor(s): Jamshed Iqbal (University of Hull, United Kingdom) and Yang Yue (Xi'an Jiaotong University, P.R. China)

Publisher: EAI
ISBN: 978-1-63190-534-6
ISSN: 2593-7642
Series: CORE

Conference dates: 24th–26th Apr 2026
Location: Singapore, Singapore

Appeared in EUDL: 2026-09-02

Ordered by title or year

Showing 81–90 of 97 results

Page size: 102550

Electronic Circuits, Computing Architectures and Communication Systems

Comparative Analysis of First-Order, Second-Order, and Fourth-Order Low-Pass Filters in Amplitude Modulation Synchronous Demodulation Systems
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Gujiacheng Tang
Common-Mode Voltage Suppression of a Five-Level ANPC Inverter Based on a Novel SVPWM Strategy
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Sizhe Wei
Analysis of Wide Temperature Range and Low Temperature Coefficient Bandgap Reference
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Xinyi Zou
Load Evolution and Gain/Linearity Trade-off Mechanisms in High-Performance Single-Stage Amplifiers
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Yuxiang Sun
A Wide Temperature Range CMOS Bandgap Voltage Reference With 4.689ppm/°C in 65nm
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Chuangjia Liao
Analysis and Simulation Study on the Impact of MOSFET Second-Order Effects on Common-Source Amplifier Performance
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Zikai Guo
Analysis of Performance-Influencing Factors and Optimization Strategies for Single-Stage Amplifiers
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Songyuan He
Mismatch Analysis and Calibration Techniques in Modern CMOS: From Current Mirror to SAR ADC
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Jian Ding, Guanlin Liu
Structural Modeling and Performance Optimization of Metal-based Radiative Cooling Composites
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Zechen Dai, Lei Tang
Research on Motion Modeling and Numerical Solution for Float-Oscillator Systems in Wave Energy Devices
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Keyang Liu, Xiaoyang Shi, Mindong Liu

About EAI

Community

Publish with EAI