ICMEEA

Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

2026 3rd International Conference on Mechanics, Electronics Engineering and Automation (ICMEEA 2026), was held in Singapore (hybrid) during April 24-26, 2026, providing a forum for researchers and experts involved in different but related domains to confront research results. The scope of ICMEEA 2026 includes the research and development of collaboration technologies to mechanical engineering, electronic engineering, control system and automation of systems.

Editor(s): Jamshed Iqbal (University of Hull, United Kingdom) and Yang Yue (Xi'an Jiaotong University, P.R. China)

Publisher: EAI
ISBN: 978-1-63190-534-6
ISSN: 2593-7642
Series: CORE

Conference dates: 24th–26th Apr 2026
Location: Singapore, Singapore

Appeared in EUDL: 2026-09-02

Ordered by title or year

Showing 61–70 of 97 results

Page size: 102550

Additive Manufacturing, Materials and Industrial Intelligence

The Application of 3D Printed Concrete in the Construction Field
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Junhong Li
Machine Learning-Based Optimization of Temperature, Speed, and Layer Thickness in FDM 3D Printing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Zhuoran Zhou
Research Status of Approaches to Reduce the Stair-Step Effect in 3D Printing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Yankun Jia
Research Status of Material Design for Intelligent Structures in 4D Printing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Zhe Li
Current Research Status in Continuous Fiber-Reinforced Composites Printing Path Planning
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Yunkai Bi
Current Applications of 3D Printing in Custom Automotive Tooling
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Tianrun Bi
Improving Computational Accuracy during the Entire 3D Printing Process Research Progress
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Yihan Zhang
Survey on Optimization of Support Structures in 3D Printing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Haoyang Pang
Topology Optimization Design and Partitioning Methods for Multi-axis Support-free Printing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Kaiyin Shi
Research on Welding Defect Detection Based on Visual Technology
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Cheng Shi

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