ICMEEA

Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

2026 3rd International Conference on Mechanics, Electronics Engineering and Automation (ICMEEA 2026), was held in Singapore (hybrid) during April 24-26, 2026, providing a forum for researchers and experts involved in different but related domains to confront research results. The scope of ICMEEA 2026 includes the research and development of collaboration technologies to mechanical engineering, electronic engineering, control system and automation of systems.

Editor(s): Jamshed Iqbal (University of Hull, United Kingdom) and Yang Yue (Xi'an Jiaotong University, P.R. China)

Publisher: EAI
ISBN: 978-1-63190-534-6
ISSN: 2593-7642
Series: CORE

Conference dates: 24th–26th Apr 2026
Location: Singapore, Singapore

Appeared in EUDL: 2026-09-02

Ordered by title or year

Showing 51–60 of 97 results

Page size: 102550

Additive Manufacturing, Materials and Industrial Intelligence

The Application of the Internet of Things in Soil Monitoring
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Yiming Ren
From Alloys to Non-Metals: The Evolution of Superconducting Materials
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Jiawen Wang
Topology Optimization for Performance Enhancement of Automotive Components: Integration with Additive Manufacturing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Bolin Chen
Current Research Status of Self-Supporting Structure Topology Optimization in Additive Manufacturing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Fan Shen
Research Status of Materials and Structural Design of 3D Printed Parts Considering the Factor of Gravity Balance
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Zixuan Liu, Yu Wu
Application and Development of 3D Printing Technology in Flexible Circuits
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Haobo Zhang
Interface Fusion in Multi-Material Additive Manufacturing Technology
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Yifan Zhang
Research Progress on Support Structures for 3D Printing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Chenyang Wang
Influencing Factors and Optimization Study on Mechanical Properties of Continuous Fiber-Reinforced Composite Materials in 3D Printing
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Wenlin Peng
Research Status of Process Monitoring and Adaptive Control in DED
Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

Xinyi Lin

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