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    ICMEEA

    Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

    2026 3rd International Conference on Mechanics, Electronics Engineering and Automation (ICMEEA 2026), was held in Singapore (hybrid) during April 24-26, 2026, providing a forum for researchers and experts involved in different but related domains to confront research results. The scope of ICMEEA 20…

    2026 3rd International Conference on Mechanics, Electronics Engineering and Automation (ICMEEA 2026), was held in Singapore (hybrid) during April 24-26, 2026, providing a forum for researchers and experts involved in different but related domains to confront research results. The scope of ICMEEA 2026 includes the research and development of collaboration technologies to mechanical engineering, electronic engineering, control system and automation of systems.

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    Editor(s): Jamshed Iqbal (University of Hull, United Kingdom) and Yang Yue (Xi'an Jiaotong University, P.R. China)
    Publisher
    EAI
    ISBN
    978-1-63190-534-6
    ISSN
    2593-7642
    Series
    CORE
    Conference dates
    24th–26th Apr 2026
    Location
    Singapore, Singapore
    Appeared in EUDL
    2026-09-02

    Copyright © 2026–2026 EAI

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    Additive Manufacturing, Materials and Industrial Intelligence

    • Analysis of Welding Robot Seam Recognition and Tracking Based on Visual Sensing

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Zhiyan Zeng
    • Analysis of an Intelligent Robotic Grasping System for Waste Sorting

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Ziang Xiao, Meixin Wang, Zhiyi Yuan

    Electronic Circuits, Computing Architectures and Communication Systems

    • A Multi-Dimensional Evaluation Framework for Matrix-Based AI Accelerators: GPU, FPGA, and ASIC

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Kangzhe Peng
    • Intelligent Adaptive VDD Scaling Architecture under the Breakthrough of Physical Limits

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Lingyi Zhang
    • Design of a Multi-mode Clock Divider Based on Dual Finite State Machine

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Tianhao Luo
    • Design and Optimization of a 4-bit Binary Synchronous Counter Based on Logical Effort

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Hongjia Lin
    • Modeling the Impact of Polymer Passivation on Graphene FET Stability

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Chang Cheng
    • From Logical Effort to Machine Learning: A Survey on Delay Modeling in Digital Circuits

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Yifan Liu
    • Concentration-Tunable Liquid Graphene Oxide Magneto-Optical Sensor for Smart Grid Current Monitoring

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Junyu Cheng
    • Comparative Analysis of Spectral Efficiency and BER Performance for BPSK, BFSK-COH, and OOK Modulation Schemes

      Research Article in Proceedings of the 3rd International Conference on Mechanics, Electronics Engineering and Automation, ICMEEA 2026, April 24-26, 2026, Singapore, Singapore

      Xincheng Wang
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