Application and Development of 3D Printing Technology in Flexible Circuits

Flexible circuits hold application prospects, However, traditional manufacturing processes present challenges, including cumbersome workflows, difficulty in accommodating complex three-dimensional surfaces, and constraints on design innovation. The advent of 3D printing technology offers a solution. This paper provides a review of 3D printing technology for flexible circuits. It begins by outlining the limitations of traditional manufacturing methods for flexible circuits. Subsequently, it focuses on analysing 3D printing technologies suitable for flexible circuits, including the working principles of material jetting and material extrusion techniques. It elaborates on the achievements of 3D printing technology in overcoming traditional manufacturing constraints and its applications in sensors and flexible displays, while also exploring the limitations including material properties, printing resolution, and efficiency. Ultimately, it outlines development trends across three directions: breakthroughs in process precision, innovations in material functionality, and the integration of intelligent systems. The paper reviews applications and bottlenecks, offering academic reference value and engineering guidance for innovation in flexible electronics, thereby accelerating the industrialization of achievements.