Research Article
3D on-chip networking technology based on post-silicon devices for future networks-on-chip
@INPROCEEDINGS{10.1109/NANONET.2006.346233, author={ S. Fujita and K. Nomura and K. Abe and T.H. Lee}, title={3D on-chip networking technology based on post-silicon devices for future networks-on-chip}, proceedings={1st International ICST Conference on Nano-Networks}, publisher={IEEE}, proceedings_a={NANO-NET}, year={2007}, month={4}, keywords={}, doi={10.1109/NANONET.2006.346233} }
- S. Fujita
K. Nomura
K. Abe
T.H. Lee
Year: 2007
3D on-chip networking technology based on post-silicon devices for future networks-on-chip
NANO-NET
IEEE
DOI: 10.1109/NANONET.2006.346233
Abstract
We propose a 3D architecture using post-silicon devices, such as nano-mechanical electrical switches, carbon nanotube FETs, and nanowire FETs, for future networks-on-chip (NoC). Based on such a new 3D architecture, extremely high bandwidth with very low latency can be realized. These promising features are very useful for future NoCs
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