Research Article
Study Of Decapsulation On IC With Temperature And Volume H2SO4 Variation
@INPROCEEDINGS{10.4108/eai.7-11-2023.2342946, author={Budiana Budiana and Illa Aryeni and Hana Mutialif Maulidiah and Galih Hanif Arrahim and Muhammad Arifin}, title={Study Of Decapsulation On IC With Temperature And Volume H2SO4 Variation}, proceedings={Proceedings of the 6th International Conference on Applied Engineering, ICAE 2023, 7 November 2023, Batam, Riau islands, Indonesia}, publisher={EAI}, proceedings_a={ICAE}, year={2024}, month={1}, keywords={decapsulation die h2so4 ic}, doi={10.4108/eai.7-11-2023.2342946} }- Budiana Budiana
Illa Aryeni
Hana Mutialif Maulidiah
Galih Hanif Arrahim
Muhammad Arifin
Year: 2024
Study Of Decapsulation On IC With Temperature And Volume H2SO4 Variation
ICAE
EAI
DOI: 10.4108/eai.7-11-2023.2342946
Abstract
Decapsulation is the process of opening the polymer layer covering the die. The purpose of decapsulation on IC is to facilitate checks on the quality of the die. The method carried out in this study uses the method of dripping H2SO4 on the IC surface. The variables to be examined in this study are variations in the use of H2SO4 volume and H2SO4 temperature. The volume variation used consists of 0.1130 ml (10 drops), 0.1356 ml (12 drops) and 0.1582 ml (14 drops). While the temperature variation used in this study consisted of 165 C, 170 C and 175 C. The results showed that all samples is not completed decapsulation process. Some samples (B, C, E, F, H, and I) is partial decapsulation while other sample is not open die at all. Moreover, Sample C exhibits the greatest thickness reduction among all the samples under examination, and the die is distinctly visible.
