Research Article
Staging Time Evaluation of Transfer Molding to PMC Process Towards Delamination on IC Package
@INPROCEEDINGS{10.4108/eai.5-10-2022.2329496, author={Afandi Kelana and Fitriyanti Nakul}, title={Staging Time Evaluation of Transfer Molding to PMC Process Towards Delamination on IC Package}, proceedings={Proceedings of the 5th International Conference on Applied Engineering, ICAE 2022, 5 October 2022, Batam, Indonesia}, publisher={EAI}, proceedings_a={ICAE}, year={2023}, month={6}, keywords={staging time moisture delamination integrated circuit (ic)}, doi={10.4108/eai.5-10-2022.2329496} }- Afandi Kelana
Fitriyanti Nakul
Year: 2023
Staging Time Evaluation of Transfer Molding to PMC Process Towards Delamination on IC Package
ICAE
EAI
DOI: 10.4108/eai.5-10-2022.2329496
Abstract
Moisture-induced delamination is one of the reliability concerns in electronic packaging. This work evaluates moisture absorption changes by the staging time approach during the transfer molding to the post molding curing (PMC) process and the impact of moisture changes on the delamination of the integrated circuit (IC) packages. These experimental results can be used as a recommendation to determine the limit of staging time in line production properly and how this method can prevent interfacial delamination on packages during the reflow process. The package reliability were observed by perform SAM visual inspection.
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