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Proceedings of the 4th International Conference on Informatization Economic Development and Management, IEDM 2024, February 23–25, 2024, Kuala Lumpur, Malaysia

Research Article

Analysis of Supply Chain Risk in the Semiconductor Industry

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  • @INPROCEEDINGS{10.4108/eai.23-2-2024.2345901,
        author={Biying  Qiu},
        title={Analysis of Supply Chain Risk in the Semiconductor Industry},
        proceedings={Proceedings of the 4th International Conference on Informatization Economic Development and Management, IEDM 2024, February 23--25, 2024, Kuala Lumpur, Malaysia},
        publisher={EAI},
        proceedings_a={IEDM},
        year={2024},
        month={5},
        keywords={supply chain risk agility resilience complexity dynamic chip},
        doi={10.4108/eai.23-2-2024.2345901}
    }
    
  • Biying Qiu
    Year: 2024
    Analysis of Supply Chain Risk in the Semiconductor Industry
    IEDM
    EAI
    DOI: 10.4108/eai.23-2-2024.2345901
Biying Qiu1,*
  • 1: University of New South Wales
*Contact email: biyingbik@163.com

Abstract

Driven by globalisation and various industry trends, the business environment is increasingly uncertain. The continuous risk of unexpected disruptions in the supply chain has led companies to focus more on risk management. Affected by global trends such as trade conflicts and increased market competition, the semiconductor industry - especially chip companies - is particularly at risk. This study identifies and analyses the supply chain risk types of chip companies by contextual analysis and machine learning methods and aims to increase companies’ awareness of key risks. According to the research results, the complexity and dynamics of risks borne by companies are increasing. Among the various risk types, technical risk is a key concern for companies. Based on the complexity and dynamic changes of risks, it is necessary to enhance risk management capabilities by fostering agility and resilience management.

Keywords
supply chain risk agility resilience complexity dynamic chip
Published
2024-05-15
Publisher
EAI
http://dx.doi.org/10.4108/eai.23-2-2024.2345901
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