Proceedings of the 2nd International Conference on Internet Technology and Educational Informatization, ITEI 2022, December 23-25, 2022, Harbin, China

Research Article

Discussion on Application of 3D Reconstruction in Landfill

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  • @INPROCEEDINGS{10.4108/eai.23-12-2022.2329075,
        author={Ting  LIN and Changxin  NAI},
        title={Discussion on Application of 3D Reconstruction in Landfill},
        proceedings={Proceedings of the 2nd International Conference on Internet Technology and Educational Informatization, ITEI 2022, December 23-25, 2022, Harbin, China},
        publisher={EAI},
        proceedings_a={ITEI},
        year={2023},
        month={6},
        keywords={solid waste landfill; 3d reconstruction; applicability; risk avoidance component},
        doi={10.4108/eai.23-12-2022.2329075}
    }
    
  • Ting LIN
    Changxin NAI
    Year: 2023
    Discussion on Application of 3D Reconstruction in Landfill
    ITEI
    EAI
    DOI: 10.4108/eai.23-12-2022.2329075
Ting LIN1, Changxin NAI1,*
  • 1: Shandong Technology and Business University
*Contact email: ncx_lab@163.com

Abstract

Objectively, intelligent landfill management is the development trend of solid waste and hazardous waste landfill. The purpose is to clarify the development status of 3 D reconstruction technology and provide technical support for the field area of landfill reconstruction. Considering the research status of 3D reconstruction technology, analyze the advantages and scene applicability of solid waste landfill characteristics and landfill operation requirements, summarize the applicable method of 3D reconstruction, and summarize the role of reconstruction technology in solid waste landfill risk avoidance to promote the fine and intelligent management of landfill. The paper will provide ideas for future in-depth research on landfill 3D reconstruction. This electronic document is a “live” template. The various components of your paper [title, text, heads, etc.] are already defined on the style sheet, as illustrated by the portions given in this document.