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Proceeding of the 2nd International Conference Education Culture and Technology, ICONECT 2019, 20-21 August 2019, Kudus, Indonesia

Research Article

Safe School to Deal with Bullying at School in Industrial Revolution 4,0 Era: A Study Review

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  • @INPROCEEDINGS{10.4108/eai.20-8-2019.2288105,
        author={Akbar  Z and Wirasti  M and Putri  T and Aisyawati  M and Kusuma  M},
        title={Safe School to Deal with Bullying at School in Industrial Revolution 4,0 Era: A Study Review},
        proceedings={Proceeding of the 2nd International Conference Education Culture and Technology, ICONECT 2019, 20-21 August 2019, Kudus, Indonesia},
        publisher={EAI},
        proceedings_a={ICONECT},
        year={2019},
        month={10},
        keywords={safe school bullying students},
        doi={10.4108/eai.20-8-2019.2288105}
    }
    
  • Akbar Z
    Wirasti M
    Putri T
    Aisyawati M
    Kusuma M
    Year: 2019
    Safe School to Deal with Bullying at School in Industrial Revolution 4,0 Era: A Study Review
    ICONECT
    EAI
    DOI: 10.4108/eai.20-8-2019.2288105
Akbar Z1,*, Wirasti M1, Putri T1, Aisyawati M1, Kusuma M1
  • 1: Universitas Negeri Jakarta, Indonesia
*Contact email: zarina_akbar@unj.ac.id

Abstract

Children spend more time in school in their daily lives. Therefore, the school is the closest environment to children besides the family environment. This certainly does not rule out the possibility that children can experience abuse or violence in school or commonly referred to as bullying. Bullying in schools is rampant in Indonesia and is one of the main reasons children commit suicide. Therefore, it is necessary to create a school environment that can ensure the safety of children both physically and non-physically so that the learning process and development of children in schools can run optimally. The school environment is better known as Safe School is very important nowadays especially in industrial revolution 4,0 era.

Keywords
safe school bullying students
Published
2019-10-08
Publisher
EAI
http://dx.doi.org/10.4108/eai.20-8-2019.2288105
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