Research Article
Patent Competitive Analysis of the Global Three-Dimensional Printing Technology Development
@INPROCEEDINGS{10.4108/eai.2-6-2023.2334589, author={Xiumei Zhong and Hongshen Pang and Jindong Tian and Xinghua Wei and Dan Mao and Yake Wang}, title={Patent Competitive Analysis of the Global Three-Dimensional Printing Technology Development}, proceedings={Proceedings of the 2nd International Conference on Information Economy, Data Modeling and Cloud Computing, ICIDC 2023, June 2--4, 2023, Nanchang, China}, publisher={EAI}, proceedings_a={ICIDC}, year={2023}, month={8}, keywords={competitive analysis three-dimensional printing additive manufacturing advanced manufacturing}, doi={10.4108/eai.2-6-2023.2334589} }- Xiumei Zhong
Hongshen Pang
Jindong Tian
Xinghua Wei
Dan Mao
Yake Wang
Year: 2023
Patent Competitive Analysis of the Global Three-Dimensional Printing Technology Development
ICIDC
EAI
DOI: 10.4108/eai.2-6-2023.2334589
Abstract
Three-dimensional printing technology, as one of the most rapidly developing technologies in the advanced manufacturing sector, has a broad range of applications in modern industry. However, most existing studies have focused on technical or application aspects, with few studies highlighting current technological competitive ability and growth of 3DP technology from a broader perspective. As a result, this study provides a comprehensive analysis of patent documentation in the global 3DP market, finding global research and development activities. The study determines the dynamics of patent activity and identifies the leading countries and top patent holders in the considered technological area. It also shows the 3DP industry's technological competitive landscape.
