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Proceedings of the 6th International Conference on Innovation in Education, Science, and Culture, ICIESC 2024, 17 September 2024, Medan, Indonesia

Research Article

Utilization of the NodeMCU ESP8266 Electronic Bord to Support IoV-Based Projects in AEEE Studies

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  • @INPROCEEDINGS{10.4108/eai.17-9-2024.2352849,
        author={Henry  Iskandar and S.  Triono and Safri  Gunawan and Hidir  Efendi and Lisyanto  Lisyanto and Dwiki Muda Yulanto},
        title={Utilization of the NodeMCU ESP8266 Electronic Bord to Support IoV-Based Projects in AEEE Studies},
        proceedings={Proceedings of the 6th International Conference on Innovation in Education, Science, and Culture, ICIESC 2024, 17 September 2024, Medan, Indonesia},
        publisher={EAI},
        proceedings_a={ICIESC},
        year={2025},
        month={1},
        keywords={automotive mechatronics nodemcu esp8266 internet of vehicles (iov) comfort safety information and technology (csit)},
        doi={10.4108/eai.17-9-2024.2352849}
    }
    
  • Henry Iskandar
    S. Triono
    Safri Gunawan
    Hidir Efendi
    Lisyanto Lisyanto
    Dwiki Muda Yulanto
    Year: 2025
    Utilization of the NodeMCU ESP8266 Electronic Bord to Support IoV-Based Projects in AEEE Studies
    ICIESC
    EAI
    DOI: 10.4108/eai.17-9-2024.2352849
Henry Iskandar1,*, S. Triono2, Safri Gunawan1, Hidir Efendi3, Lisyanto Lisyanto1, Dwiki Muda Yulanto1
  • 1: Automotive Engineering Education Department, Faculty of Technical Engineering, Universitas Negeri Medan
  • 2: Mechanical Engineering Education Department, Faculty of Engineering, Universitas Negeri Medan, Jl. Willem Iskandar Pasar V, Medan, Indonesia
  • 3: Mechanical Engineering Education, Faculty of Technical Engineering, Universitas Negeri Medan, Indonesia, Jl. Willem Iskandar Pasar V, Medan, Indonesia
*Contact email: henryiskandar@unimed.ac.id

Abstract

This study aims to develop an outcome-based learning approach in Automotive Mechatronics skills by utilizing NodeMCU ESP8266 as a hardware platform. This approach involves a project-based learning model where students design and develop Comfort Safety Information and Technology (CSIT) for vehicles. This system integrates Internet of Vehicle (IoV) technology through the Back Door (open/close) System (BDS) in the form of a prototype. This study involved eight students who studied in groups to develop the system for 21 days. The results showed that this approach effectively improved students' skills in Automotive Mechatronics, especially in designing and developing IoV-based systems. This study also highlights the importance of considering the rapid technological advances in the automotive sector and the need for continuous curriculum updates to ensure that graduates are ready to work in the industry.

Keywords
automotive mechatronics nodemcu esp8266 internet of vehicles (iov) comfort safety information and technology (csit)
Published
2025-01-14
Publisher
EAI
http://dx.doi.org/10.4108/eai.17-9-2024.2352849
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