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Innovations and Interdisciplinary Solutions for Underserved Areas. 7th International Conference, InterSol 2024, Dakar, Senegal, July 3–4, 2024, Proceedings

Research Article

Towards a Single-Sign-On Authentication Architecture Based on OpenID Connect Protocol and Blockchain Technology

Cite
BibTeX Plain Text
  • @INPROCEEDINGS{10.1007/978-3-031-86493-3_8,
        author={Assane Ilboudo and Didier Bassole and Justin Pegdwind\^{e} Kouraogo and Gouayon Koala and Oumarou Sie},
        title={Towards a Single-Sign-On Authentication Architecture Based on OpenID Connect Protocol and Blockchain Technology},
        proceedings={Innovations and Interdisciplinary Solutions for Underserved Areas. 7th International Conference, InterSol 2024, Dakar, Senegal, July 3--4, 2024, Proceedings},
        proceedings_a={INTERSOL},
        year={2025},
        month={4},
        keywords={Authentication Security Blockchain OpenID Connect},
        doi={10.1007/978-3-031-86493-3_8}
    }
    
  • Assane Ilboudo
    Didier Bassole
    Justin Pegdwindé Kouraogo
    Gouayon Koala
    Oumarou Sie
    Year: 2025
    Towards a Single-Sign-On Authentication Architecture Based on OpenID Connect Protocol and Blockchain Technology
    INTERSOL
    Springer
    DOI: 10.1007/978-3-031-86493-3_8
Assane Ilboudo1,*, Didier Bassole1, Justin Pegdwindé Kouraogo1, Gouayon Koala1, Oumarou Sie1
  • 1: Laboratoire de Mathématiques et d’Informatique
*Contact email: assaneilboudo1998@gmail.com

Abstract

OpenID Connect is a delegated authentication protocol used in web and mobile applications. It emphasizes the crucial role of third-party applications, also known as Relying Parties, which securely request information from an identity provider. In this article, we have proposed an approach based on the Ethereum blockchain to enhance the authentication process and user account privacy within the OpenID Connect protocol. This mechanism adds an additional layer of protection.

Keywords
Authentication Security Blockchain OpenID Connect
Published
2025-04-21
Appears in
SpringerLink
http://dx.doi.org/10.1007/978-3-031-86493-3_8
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