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Context-Aware Systems and Applications. 11th EAI International Conference, ICCASA 2022, Vinh Long, Vietnam, October 27-28, 2022, Proceedings

Research Article

A Survey of On-Chip Hybrid Interconnect for Multicore Architectures

Cite
BibTeX Plain Text
  • @INPROCEEDINGS{10.1007/978-3-031-28816-6_5,
        author={Cuong Pham-Quoc},
        title={A Survey of On-Chip Hybrid Interconnect for Multicore Architectures},
        proceedings={Context-Aware Systems and Applications. 11th EAI International Conference, ICCASA 2022, Vinh Long, Vietnam, October 27-28, 2022, Proceedings},
        proceedings_a={ICCASA},
        year={2023},
        month={3},
        keywords={Multicore systems Hybrid interconnect FPGA ASIC},
        doi={10.1007/978-3-031-28816-6_5}
    }
    
  • Cuong Pham-Quoc
    Year: 2023
    A Survey of On-Chip Hybrid Interconnect for Multicore Architectures
    ICCASA
    Springer
    DOI: 10.1007/978-3-031-28816-6_5
Cuong Pham-Quoc1,*
  • 1: Ho Chi Minh City University of Technology (HCMUT), 268 Ly Thuong Kiet Street
*Contact email: cuongpham@hcmut.edu.vn

Abstract

In this paper, we present a survey of hybrid interconnects for multicore architecture proposed in the literature. Before making a survey, we introduce an overview of on-chip hybrid interconnects and the taxonomies to classify them. We also present different architectures of standard interconnects that are frequently used for multi/many-core system in both the academia and industry. Finally, we conduct a survey of hybrid interconnects where we categorize them into two different groups. The first one includes hybrid interconnects that create the interconnects by using different Network-on-Chip topologies. We named this group astopology-mixture hybrid interconnect. The second group, namedarchitecture-mixture hybrid interconnects, combines different architectures, such as bus and NoC, to form hybrid interconnects.

Keywords
Multicore systems Hybrid interconnect FPGA ASIC
Published
2023-03-24
Appears in
SpringerLink
http://dx.doi.org/10.1007/978-3-031-28816-6_5
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