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Cloud Computing. 11th EAI International Conference, CloudComp 2021, Virtual Event, December 9–10, 2021, Proceedings

Research Article

Trustworthy IoT Computing Environment Based on Layered Blockchain Consensus Framework

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  • @INPROCEEDINGS{10.1007/978-3-030-99191-3_13,
        author={Yueyu Dong and Fei Dai and Mingming Qin},
        title={Trustworthy IoT Computing Environment Based on Layered Blockchain Consensus Framework},
        proceedings={Cloud Computing. 11th EAI International Conference, CloudComp 2021, Virtual Event, December 9--10, 2021, Proceedings},
        proceedings_a={CLOUDCOMP},
        year={2022},
        month={3},
        keywords={Trustworthy IoT Blockchain Consensus framework},
        doi={10.1007/978-3-030-99191-3_13}
    }
    
  • Yueyu Dong
    Fei Dai
    Mingming Qin
    Year: 2022
    Trustworthy IoT Computing Environment Based on Layered Blockchain Consensus Framework
    CLOUDCOMP
    Springer
    DOI: 10.1007/978-3-030-99191-3_13
Yueyu Dong, Fei Dai,*, Mingming Qin
    *Contact email: daifei@swfu.edu.cn

    Abstract

    The Internet of Things is widely used and has far-reaching significance. It is essential to ensure the trustworthiness of the IoT computing environment. Using blockchain technology to store and manage the data traces in the IoT is feasible to implement the trustworthy IoT. In a “Cloud-Edge-End” structure, the difference in the degree of energy constraint between various parts makes the use of the same consensus algorithm a compromise between overall performance degradation and energy constraints on terminal devices. We take advantage of the high modularity of the chained consensus algorithm to build a layered consensus mechanism framework, running a two-phase consensus algorithm in the local environment of the terminal devices, and a three-phase consensus algorithm with better overall performance. Preliminary evaluation shows that this scheme is feasible.

    Keywords
    Trustworthy IoT Blockchain Consensus framework
    Published
    2022-03-23
    Appears in
    SpringerLink
    http://dx.doi.org/10.1007/978-3-030-99191-3_13
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