Throughput Analysis for Full-Duplex Based Device-to-Device Communications

Yajun Shang; Xuehan Meng; Xiaomeng Chai; Tong Liu; Zhongshan Zhang

5G for Future Wireless Networks. First International Conference, 5GWN 2017, Beijing, China, April 21-23, 2017, Proceedings

Research Article

Throughput Analysis for Full-Duplex Based Device-to-Device Communications

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@INPROCEEDINGS{10.1007/978-3-319-72823-0_19,
    author={Yajun Shang and Xuehan Meng and Xiaomeng Chai and Tong Liu and Zhongshan Zhang},
    title={Throughput Analysis for Full-Duplex Based Device-to-Device Communications},
    proceedings={5G for Future Wireless Networks. First International Conference, 5GWN 2017, Beijing, China, April 21-23, 2017, Proceedings},
    proceedings_a={5GWN},
    year={2018},
    month={1},
    keywords={Device-to-device Full duplex Throughput Interference},
    doi={10.1007/978-3-319-72823-0_19}
}

Yajun Shang
Xuehan Meng
Xiaomeng Chai
Tong Liu
Zhongshan Zhang
Year: 2018
Throughput Analysis for Full-Duplex Based Device-to-Device Communications
5GWN
Springer
DOI: 10.1007/978-3-319-72823-0_19

Yajun Shang¹, Xuehan Meng¹, Xiaomeng Chai¹, Tong Liu²^,*, Zhongshan Zhang¹^,*

1: University of Science and Technology Beijing (USTB)
2: Harbin Engineering University

*Contact email: liutong@hrbeu.edu.cn, zhangzs@ustb.edu.cn

Abstract

The throughput of Device-to-device (D2D) enabled underlaying cellular networks is analyzed, with either full duplex (FD) or conventional half duplex (HD) transmission mode considered in D2D links. Despite of the severe interference imposed on the cellular users (CUs) by the FD based D2D (FD-D2D) links, the FD-D2D mode always exhibits its superiority in terms of the network throughput due to its reduced large-scale fading as well as low transmit-power essences. Numerical results show that the proposed FD-D2D mechanism is capable of substantially improving the network throughput.

Keywords: Device-to-device Full duplex Throughput Interference

Published: 2018-01-19
Appears in: SpringerLink

: http://dx.doi.org/10.1007/978-3-319-72823-0_19